| 摘要 |
In one embodiment, a memory system is disclosed. The memory system has at least one memory chip having an address and data interface coupled to an internal address and data bus, and a memory controller and interface chip also having a an address and data interface coupled to the address and data interface of the at least one memory chip via an internal address and data bus. The at least one memory chip, the memory controller and interface chip and the internal address and data bus are disposed within a common chip package. The memory controller and interface chip has an external interface configured to be coupled to a standard memory bus via external contacts of the common chip package.
|
