| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple method for manufacturing a metal wiring board having excellent conductivity and including metal wiring that can be formed in a fine pattern as designed and has a uniform shape. SOLUTION: A method for manufacturing a metal wiring board 20 includes the steps of: (1) forming a metal layer 24a with a thickness of 40-2,000 nm on a surface of a substrate layer 22; (2) forming a self-assembled monolayer 26 on a surface of the metal layer 24a; (3) covering at least a portion of a surface of the self-assembled monolayer 26 with a resin layer 28; and (4) forming metal wiring 24 by etching and removing a part of the metal layer 24a. In the part of the metal layer 24a, the metal layer 24a is not covered with the resin layer 28. COPYRIGHT: (C)2011,JPO&INPIT
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