METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide each client with a substrate resulting from cooperatively manufacturing different LSIs from a plurality of clients while obtaining security.SOLUTION: A mask pattern 307 is formed which includes an opening 307a wherein any other region than an LSI chip area 331 subjected to provision to a specific client is open. Next, the mask pattern 307 is used as a mask to remove by etching the LSI chip area 332 exposed in the opening 307a, and a blind area 301a is formed. In forming the blind area 301a, a first wiring layer 302, a second wiring layer 303 and a third wiring layer 304 are removed to a part of the lower layer thereof.