| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent false recognition of tilt of a substrate due to solder or rubbish or the like scattered on the substrate. <P>SOLUTION: A tilt inspection device 10 comprises a height measurement part 12 for obtaining height information by measuring the surface height of a substrate 2 and a component over the entire area of the substrate 2 from an image of the imaging area outputted by a camera which takes an image of the substrate 2 in which the component is attached using a predetermined range as the imaging area. In addition, the tilt inspection device 10 comprises a measurement point designation part 13 for designating at least three measurement points expressed by the color of the substrate 2 based on binarized information which expresses the color of the substrate 2 included in the image of the imaging area and the color of the component placed in the substrate 2 in two different colors. Further, the tilt inspection device 10 comprises a tilt calculation part 14 for calculating the tilt of the substrate 2 against a predetermined flat surface based on the height information measured every measurement point and a tilt correction part 15 for calculating correction amount of the height information based on the tilt of the substrate 2 to correct the height information over the entire area of the surface of the substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
