| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming copper wiring which allows for enhancement of conductivity of copper wiring while reducing deterioration over time by preventing oxidation of copper particles and preventing combustion, and to provide a manufacturing method of a wiring board, and a wiring board. <P>SOLUTION: The method of forming copper wiring includes a patterning step for forming a wiring pattern of carbon coated copper particles 14 having a particle size of 100 nm or less on a substrate 10, an oxygen plasma processing step for performing oxygen plasma processing of the wiring pattern, and a reduction plasma processing step for performing reduction plasma processing of the wiring pattern. A manufacturing method of a wiring board, and a wiring board are also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
