| 摘要 |
The present invention relates to a process for surface structuring, that is to say, for meaning forming at least one array of patterns with a submillimeter scale characteristic lateral dimension on a flat surface of a product comprising a substrate bearing at least one layer resulting from a sol-gel process, where the structuring is done hot with a hydrolyzed sol layer based on alkoxides and/or halide(s) of at least one metal chosen among Si, Ti, Zr, W, Sb, Hf, Ta, V, Mg, Al, Mn, Co, Ni, Sn, Zn, and Ce with a nonreactive organic group, where the structuring is carried out by contact with a structured mask and exerting pressure as needed, and where the structuring is carried out in a temperature range suited for a sufficient condensation threshold ensuring the thermal hold of the structuring, with a total structuring time less than or equal to two hours. The invention also covers the resulting product. |
