发明名称 Underfill formulation and method of increasing an adhesion property of same
摘要 An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
申请公布号 US8354467(B2) 申请公布日期 2013.01.15
申请号 US201113025625 申请日期 2011.02.11
申请人 INTEL CORPORATION;SHEKHAWAT LINDA A.;CONSTABLE GREGORY S.;XU YOUZHI E.;ANATHAKRISHAN NISHA 发明人 SHEKHAWAT LINDA A.;CONSTABLE GREGORY S.;XU YOUZHI E.;ANATHAKRISHAN NISHA
分类号 C08G65/32;C08L63/00 主分类号 C08G65/32
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