MANUFACTURING METHOD OF CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a circuit board is provided to improve inefficiency of a process according to an insulation material coated during the front face process after the insulation material is plugged, by applying a method of using a mask with fixed patterns. CONSTITUTION: According to a method for manufacturing a circuit board, a plate type conductive raw material is prepared (S100). A mask having a fixed pattern is formed on one side of the conductive raw material (S200). An insulation material is filled in an aperture and the mask is removed (S300). The conductive raw material is plated as thick as the filled insulation material (S400). The insulation material is exposed by etching the other side of the conductive raw material according to the fixed pattern (S500). [Reference numerals] (AA) Start; (BB) End; (S100) Prepare a plate type conductive raw material; (S200) Form a mask on upper surface of the conductive raw material; (S300) Fill an insulation material in an aperture and remove the mask; (S400) Plate an exposed area of the conductive raw material; (S500) Etch the lower surface of the conductive raw material