发明名称 |
ELECTROCONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN |
摘要 |
The present invention addresses the problem of providing an electroconductive pattern which has such a high level of adhesion that an electroconductive layer comprising an electroconductive substance such as silver, etc. does not peel off from a primer layer over time. An electroconductive pattern according to the present invention, wherein an electroconductive layer (A) that comprises a compound (a1) having a basic nitrogen atom-containing group and an electroconductive substance (a2), a primer layer (B) that comprises a compound (b1) containing a functional group [X], and a supporting layer (C) are stacked, is characterized in that the basic nitrogen atom-containing group of the compound (a1) in the electroconductive layer (A) is reacted with the functional group [X] of the compound (b1) in the primer layer (B) to thereby form a bond. |
申请公布号 |
WO2013146195(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
WO2013JP56486 |
申请日期 |
2013.03.08 |
申请人 |
DIC CORPORATION |
发明人 |
MURAKAWA AKIRA;SHIRAKAMI JUN;FUJIKAWA WATARU;SAITOU YUKIE |
分类号 |
H05K3/38;H05K1/09;H05K3/12;H05K9/00 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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