MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME

摘要

An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.

主权项

1. An electronic module comprising:
a circuit board including a main surface, a land electrode formed on the main surface and a resist pattern having an overlapped portion that covers the land electrode; a chip component mounted on the main surface of the circuit board, the chip component including a bottom electrode substantially parallel to the main surface of the circuit board and a side electrode substantially perpendicular to the main surface of the circuit board; a solder electrically connecting the bottom and side electrodes of the chip component to the land electrode of the circuit board, the solder including a first solder portion adhered to the side electrode and a second solder portion provided between the bottom electrode and the land electrode; and a mold member formed on the main surface of the circuit board so as to seal the chip component, the mold member having a first portion filling a first gap between the overlapped portion and the first solder portion.