| 摘要 |
<p>A sputtering device according to an embodiment of the present invention includes: a substrate arranged on a substrate supporting unit, a backing plate which faces the substrate, multiple sputtering targets arranged on the backing plate, a division surface which is formed between the sputtering targets and exposes the backing plate, a magnetron which is arranged on the back side of the backing plate and generates a magnetic field, and multiple shield layers which are arranged between the sputtering targets and the magnetron. Each of the shield layers is arranged in a part which corresponds to the division surface.</p> |
