发明名称 樹脂多層基板
摘要 <p>A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.</p>
申请公布号 JP5787021(B2) 申请公布日期 2015.09.30
申请号 JP20140500729 申请日期 2013.02.20
申请人 发明人
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
主权项
地址
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