发明名称 Heat dissipating apparatus for folding electronic devices
摘要 Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.
申请公布号 US9148979(B2) 申请公布日期 2015.09.29
申请号 US201213706492 申请日期 2012.12.06
申请人 QUALCOMM Incorporated 发明人 Chiriac Victor A.;Chun Dexter T.
分类号 H05K7/20;G06F1/20;H05K13/04;H01L23/473 主分类号 H05K7/20
代理机构 代理人 Gallardo Michelle S.
主权项 1. A folding electronic device, comprising: a base portion including a region configured to generate heat; a cover portion including: a display screen;a heat dissipating component parallel to and spaced apart from a rear surface of the display screen; anda thermally insulating component configured to insulate the rear surface of the display screen from heat dissipated from the heat dissipating component, wherein the thermally insulating component is located between the rear surface of the display screen and the heat dissipating component; and a coupler for thermally coupling the base portion to the cover portion, the coupler including a first component, a second component, and a third component, the first component coupled to the region configured to generate heat, the second component coupled to the heat dissipating component, and the third component passing through the first and second components and thermally coupling the first and second components, the coupler providing a path for transferring heat.
地址 San Diego CA US