发明名称 研磨パッド溝加工機及び研磨パッド溝加工方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing pad grooving machine capable of reliably removing chips twining around a cutting edge, and capable of improving the efficiency of recovering the chips. <P>SOLUTION: The polishing pad grooving machine includes: a cutting device 2 where the cutting edge 20 for cutting and forming multi-thread grooves on a surface of a polishing pad 1 by acting on the surface of polishing pad 1; a rear side air blowing device 3, which is positioned at the rear side in the cutting direction of the cutting edge 20, and which blows air toward the direction of the cutting edge 20; and a dust introduction unit 4, which is positioned at the front position in the cutting direction of the cutting edge 20 for suction and collection of the chips generated by the cutting. The dust introduction unit 4 includes: a dust collecting box 40 having a dust collecting port 40a which can be set at the position opposed to the surface of the polishing pad 1; and a straightening vane 41 for guiding the chips upward to the dust collecting port. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5785026(B2) 申请公布日期 2015.09.24
申请号 JP20110173833 申请日期 2011.08.09
申请人 发明人
分类号 B23B5/48;B23B25/00;B23Q11/00 主分类号 B23B5/48
代理机构 代理人
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