METHOD FOR FORMING VOIDS AND STRUCTURE WITH VOIDS FORMED USING THE SAME

摘要

A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

主权项

1. A structure with voids, comprising:
a circuit board, comprising at least a copper foil having a pad region, wherein the pad region has at least a void with width XV and length YV, and a perimeter of the void is equal to two times a sum of the width XV and the length YV; a pad with width XP and length YP, wherein the pad is disposed in the pad region for electrically connecting an element of the pad to the circuit board, and has a perimeter equal to two times a sum of the width XP and the length YP, the void of the pad region corresponds to a corner of the pad, the width XP and the length YP of the pad correspond to the width XV and the length YV of the void, respectively, wherein, the pad has a minimum wire width W, and the difference obtained by deducting the perimeter of the void from the perimeter of the pad must be greater than or equal to the minimum wire width W.