| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding wire having a core material including Ag, which is superior in successive bondability and productivity, and which enables the prevention of surface discoloration, and the suppression of the damage to a semiconductor device in bonding.SOLUTION: A bonding wire 10 comprises: a core material 12 including 75 mass% or more of Ag; and a discoloration-preventing layer 14 covering the outer peripheral surface of the core material 12. The discoloration-preventing layer 14 is formed by coating the outer peripheral surface of the core material 10 with an aqueous solution S including at least one kind of surfactant, and at least one kind of aliphatic organic compounds each having at least one thiol group, of which the number of carbon atoms is in a range of 8-18. |
