PACKAGED RADIO-FREQUENCY MODULE HAVING WIREBOND SHIELDING

摘要

According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

主权项

1. A packaged radio-frequency (RF) module comprising:
a packaging substrate having a reference potential layer; an RF component positioned over the packaging substrate; an overmold implemented over the packaging substrate to substantially encapsulate the RF component, the overmold including an upper surface; a conductive layer implemented on the upper surface of the overmold; and a plurality of wirebonds implemented on the packaging substrate, each of the plurality of wirebonds having a first end electrically connected to the reference potential layer and a second end electrically connected to the conductive layer, the plurality of wirebonds arranged in a pattern relative to the RF component to yield electromagnetic shielding with respect to the RF component.