CHIP TO PACKAGE INTERACTION TEST VEHICLE AND METHOD FOR TESTING CHIP TO PACKAGE INTERACTION USING THE SAME

摘要

A chip to package interaction (CPI) test vehicle includes a chip including metal patterns contained in first and second sub-regions, respectively, and in which any one of the following comparable properties (a)˜(e) is the same among the first and second sub-regions, and another one of the properties (a)˜(e) is different among the first and second sub-regions: (a) size and shape of the sub-region, (b) metal density of the metal pattern, (c) type of the metal pattern, (d) distance between the sub-region and a center of the chip, (e) structure of the metal pattern.

主权项

1. A chip to package interaction (CPI) test vehicle, comprising:
a chip including metal patterns, wherein the chip has first and second sub-regions each containing a respective one of the metal patterns, and wherein the sub-regions have at least two comparable properties selected from the group including: (a) size and shape of the sub-region, (b) density of the metal pattern in the sub-region, (c) type of the metal pattern, (d) distance between the sub-region and a center of the chip, and (e) structure of the metal pattern, and wherein one of the properties (a)-(e) is the same among the first and second sub-regions, and another of the properties of the group differs among the first and second sub-regions.