EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD

摘要

The preset invention provides a curable resin composition which causes little change in heat resistance after a heat history of cured products and exhibits low thermal expandability, and also provides a cured product of the curable resin composition, a printed circuit board causing little change in heat resistance after a heat history and having excellent low thermal expandability, and an epoxy resin having these performances. The epoxy resin is produced by polyglycidyl-etherification of a reaction product of para-cresol, a β-naphthol compound, and formaldehyde, the epoxy resin containing a trifunctional compound (x) represented by a structural formula (1) below and a dimer (y) represented by a structural formula (2) below, and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.;

主权项

1. An epoxy resin produced by polyglycidyl-etherification of a reaction product of para-cresol, a β-naphthol compound, and formaldehyde, the epoxy resin comprising a trifunctional compound (x) represented by a structural formula (1) below,(in the formula, R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and G represents a glycidyl group), and a dimer (y) represented by a structural formula (2) below,(in the formula, R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and G represents a glycidyl group), and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.