| 发明名称 |
SOLDER BALL AND CIRCUIT BOARD INCLUDING THE SAME |
| 摘要 |
A solder ball has a core, an intermediate layer, and a surface layer. In one aspect, the intermediate layer melts at a temperature higher than that of the surface layer. In another aspect, the core is made of a material that maintains a liquid state through a temperature range of from about 20° C. to about 110° C., the intermediate layer is made of a material that maintains a solid state at temperatures up to about 270° C., and the surface layer is made of a material with a melting temperature of about 230° C. to about 270° C. In another aspect, the first metal and the second metal are materials that do not form an intermetallic compound with another material in the solder ball. The solder ball may be used in a circuit board. |
| 申请公布号 |
US2015251278(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201414448150 |
申请日期 |
2014.07.31 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Jae Ean;CHO Jung Hyun;KO Kyung Hwan;BAEK Yong Ho |
| 分类号 |
B23K35/02;H05K1/18;B23K35/24 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solder ball comprising:
a core made of a material that maintains a liquid state through a temperature range of from about 20° C. to about 110° C.; an intermediate layer made of a material that maintains a solid state at temperatures up to about 270° C.; and a surface layer made of a material with a melting temperature of about 230° C. to about 270° C. |
| 地址 |
Suwon KR |
