Hybrid dicing process using a blade and laser

摘要

A method and system of hybrid dicing using a blade and laser are described. In one embodiment, a method involves focusing a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. The method also involves forming a groove on a surface of the substrate with a blade saw in the regions. The method further involves singulating the integrated circuits at the regions with the induced defects and the groove. In one embodiment, a system includes a laser module configured to focus a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. A blade grooving module is configured to form a groove in a surface of the substrate with a blade saw in the regions.

主权项

1. A method of dicing a substrate comprising a plurality of integrated circuits, the method comprising:
focusing a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions; after focusing the laser beam inside the substrate in the regions between the integrated circuits, forming a groove on a surface of the substrate with a blade saw in the regions; and singulating the integrated circuits at the regions with the induced defects and the groove.