Development of high-viscosity bonding layer through in-situ polymer chain extension

摘要

New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

主权项

1. A method of forming a temporary wafer bonding structure, said method comprising:
providing a first substrate having front and back surfaces, wherein said first substrate is a microelectronic substrate; providing a second substrate having front and back surfaces; applying a bonding composition to the front surface of at least one of said first and second substrates, said bonding composition comprising a plurality of components optionally dispersed or dissolved in a solvent system, said components having a first weight average molecular weight; contacting the front surface of the other of said first and second substrates with said bonding composition; and polymerizing said components in said bonding composition to yield a polymerized layer between said first and second substrates, said polymerized layer comprising a plurality of polymerized components having a second weight average molecular weight, said second weight average molecular weight being greater than said first molecular weight, thereby forming said temporary bonding structure.