发明名称 |
Method for manufacturing monocrystalline thin film and monocrystalline thin film device manufactured thereby |
摘要 |
The present invention provides a method for manufacturing a monocrystalline film and a device formed by the above method, and according to the method mentioned above, lift-off of the monocrystalline silicon film is preferably performed and a high-purity monocrystalline silicon film can be obtained. A monocrystalline silicon substrate (template Si substrate) 201 is prepared, and on this monocrystalline silicon substrate 201, an epitaxial sacrificial layer 202 is formed. Subsequently, on this sacrificial layer 202, a monocrystalline silicon thin film 203 is rapidly epitaxially-grown using a RVD method, followed by etching of the sacrificial layer 202, whereby a monocrystalline silicon thin film 204 used as a photovoltaic layer of solar cells is formed. |
申请公布号 |
US9130111(B2) |
申请公布日期 |
2015.09.08 |
申请号 |
US201012963168 |
申请日期 |
2010.12.08 |
申请人 |
JAPAN SCIENCE AND TECHNOLOGY AGENCY |
发明人 |
Noda Suguru |
分类号 |
C30B1/04;H01L31/18;C30B25/02;C30B29/06;C30B33/00;H01L31/0392;H01L21/02 |
主分类号 |
C30B1/04 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A method for manufacturing a solar-cell monocrystalline silicon thin film, comprising:
(a) preparing a monocrystalline silicon substrate; (b) forming an epitaxial sacrificial layer on the substrate; (c) forming a monocrystalline silicon thin film on the sacrificial layer by epitaxial growth at a temperature T(° C.) and at a film growth rate GR (μm/min) which satisfies the condition of GR>2×1012exp [−325(kJ/mol)/8.31 (J/mol·K)/(T+273)(K)]; and (d) etching the sacrificial layer so as to manufacture a monocrystalline silicon thin film used as a photovoltaic layer for solar-cells. |
地址 |
Kawaguchi-shi JP |