| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition free of halogen, and small in fluctuation of relative permittivity and dielectric loss tangent; and to provide a prepreg, laminate board and circuit board each using the composition. <P>SOLUTION: This thermosetting composition includes: (A) an aluminum salt of diethylphosphinic acid having a structure represented by general formula (1) and an average particle diameter of 0.5-3μm; (B) a maleimide compound having an N-substituted maleimide group in the molecule; (C) a curing agent comprising a 6-substituted guanamine compound or dicyandiamide; and (D) an epoxy resin having at least two epoxy groups in one molecule (in formula, R<SB POS="POST">1</SB>represents a phenyl, methyl, butyl, allyl, methoxy or benzyloxy group). The prepreg, laminate board and circuit board each using the composition are provided. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
