发明名称 |
SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS |
摘要 |
A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described. |
申请公布号 |
EP2912733(A1) |
申请公布日期 |
2015.09.02 |
申请号 |
EP20130785800 |
申请日期 |
2013.10.23 |
申请人 |
SPECTRASENSORS, INC. |
发明人 |
FEITISCH, ALFRED;NEUBAUER, GABI;SCHREMPEL, MATHIAS |
分类号 |
H01S5/022;B23K20/02;H01S5/024;H01S5/042 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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