| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To automatically measure pushing-up height positions of a pushing-up pot and a pushing-up pin of a die supply device and an XY-directional position of the pushing-up pin. <P>SOLUTION: Two cameras targeting a pushing-up pot 27 and a pushing-up pin 29 as objects to be imaged are installed at a periphery of a pushing-up unit of a die supply device, and the pushing-up pot 27 is placed in pushing-up operation with no wafer pallet set above to be elevated to project the pushing-up pin 29. In this state, while one camera picks up an X-directional side face image of the pushing-up pot 27 and pushing-up pin 29, the other camera picks up a Y-directional side face image of the pushing-up pot 27 and pushing-up pin 29. Then the X-directional and Y-directional side face images are subjected to image processing, pushing-up height positions of the pushing-up pot 27 and pushing-up pin 29 in the pushing-up operation and the XY-directional position of the pushing-up pin 29 are measured, and it is determined whether the pushing-up pin 29 is broken or curved. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
