发明名称 |
Extreme ultraviolet lithography process and mask |
摘要 |
An extreme ultraviolet lithography (EUVL) process is disclosed. The process comprises receiving a mask. The mask includes a low thermal expansion material (LTEM) substrate, a reflective multilayer (ML) over one surface of the LTEM substrate, a first region having a phase-shifting layer over the reflective ML, and a second region having no phase-shifting layer over the reflective ML. The EUVL process also comprises exposing the mask by a nearly on-axis illumination with partial coherence less than 0.3 to produce diffracted light and non-diffracted light, removing at least a portion of the non-diffracted light, and collecting and directing the diffracted light and the not removed non-diffracted light by a projection optics box (POB) to expose a target. |
申请公布号 |
US9122166(B2) |
申请公布日期 |
2015.09.01 |
申请号 |
US201313946533 |
申请日期 |
2013.07.19 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lu Yen-Cheng;Yu Shinn-Sheng;Chen Jeng-Horng;Yen Anthony |
分类号 |
G03F1/22;G03F1/24 |
主分类号 |
G03F1/22 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. An extreme ultraviolet lithography (EUVL) process, comprising:
receiving a mask, the mask including:
a low thermal expansion material (LTEM) substrate;a reflective multilayer (ML) over one surface of the LTEM substrate;a first region having a phase-shifting layer over the reflective ML; anda second region having no phase-shifting layer over the reflective ML; exposing the mask by a nearly on-axis illumination with partial coherence σ less than 0.3 to produce diffracted light and non-diffracted light; removing at least a portion of the non-diffracted light; and collecting and directing the diffracted light and the not removed non-diffracted light by a projection optics box (POB) to expose a target. |
地址 |
Hsin-Chu TW |