Method for manufacturing optical semiconductor device

摘要

A method for manufacturing an optical semiconductor device includes a step of forming a stacked semiconductor layer on a substrate, the stacked semiconductor layer including a plurality of semiconductor layers; a step of forming a mask on a top layer of the stacked semiconductor layer, the mask covering a portion of the top layer; an exposing step of exposing the top layer of the stacked semiconductor layer to an oxygen-containing atmosphere; after the exposing step, a heating step of heating the stacked semiconductor layer to a temperature of 250° C. or more; and after the heating step, a step of forming a semiconductor mesa in the stacked semiconductor layer, the semiconductor mesa being formed by etching the stacked semiconductor layer by a dry etching method using the mask. The top layer of the plurality of semiconductor layers of the stacked semiconductor layer contains arsenic.

主权项

1. A method for manufacturing an optical semiconductor device, comprising:
a step of forming a stacked semiconductor layer on a substrate, the stacked semiconductor layer including a plurality of semiconductor layers with a top layer of the plurality of layers containing arsenic; a step of forming a mask on the top layer whereby a portion of the top layer is covered by the mask and a region of the top layer is not covered by the mask; an exposing step of exposing the region of the top layer not covered by the mask to an oxygen-containing atmosphere whereby arsenic oxide forms on the region; after the exposing step, a heating step of heating the stacked semiconductor layer to a temperature of 250° C. or more to remove arsenic oxide from the top layer; and after the heating step, a step of forming a semiconductor mesa in the stacked semiconductor layer, the semiconductor mesa being formed by etching the stacked semiconductor layer by a dry etching method using the mask.