PACKAGE ON PACKAGE THERMAL FORCING DEVICE

摘要

Disclosed are a method and an apparatus for a thermal forcing device of package on package (PoP). A thermal interposer comprises: a test probe guide and an insulator upper end; a thermal conductor having the test probe guide and the insulator upper end fixed to the upper surface thereof; a test probe; and a test probe guide and an insulator bottom part fixed to the bottom of the thermal conductor, wherein the test probe guide and the insulator bottom part allows the thermal conductor pass through, and are formed in a ring shape contacting with a PoP integrated circuit (IC) bottom part.