发明名称 |
INTEGRATED CIRCUIT DEVICES INCLUDING CONTACTS AND METHODS OF FORMING THE SAME |
摘要 |
Integrated circuit devices including contacts and methods of forming the same are provided. The devices may include a fin on a substrate, a gate structure on the fin and a source/drain region in the fin at a side of the gate structure. The devices may further include a contact plug covering an uppermost surface of the source/drain region and a sidewall of the gate structure. The contact plug may include an inner portion including a first material and an outer portion including a second material different from the first material. The outer portion may at least partially cover a sidewall of the inner portion, and a portion of the outer portion may be disposed between the sidewall of the gate structure and the sidewall of the inner portion. |
申请公布号 |
US2015243747(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
US201514628541 |
申请日期 |
2015.02.23 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kittl Jorge A.;Palle Dharmendar Reddy;Rodder Mark S. |
分类号 |
H01L29/417;H01L29/45;H01L27/088;H01L29/78 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
1. An integrated circuit device, comprising:
a fin on a substrate; first and second gate structures on the fin, wherein sidewalls of the first and second gate structures define a recess therebetween; a source/drain region in the fin between the first and second gate structures; and a contact plug on the source/drain region and in the recess, the contact plug comprising an inner portion comprising a first material and an outer portion comprising a second material different from the first material, wherein: the outer portion at least partially covers a sidewall of the inner portion; and a portion of the outer portion is disposed between the sidewall of the first gate structure and the sidewall of the inner portion. |
地址 |
Suwon-si KR |