发明名称 ADJUSTMENT APPARATUS FOR ADJUSTING PROCESSING UNITS PROVIDED IN A SUBSTRATE PROCESSING APPARATUS, AND A SUBSTRATE PROCESSING APPARATUS HAVING SUCH AN ADJUSTMENT APPARATUS
摘要 An adjustment apparatus capable of adjusting various types of processing units of a substrate processing apparatus within a shorter period of time is disclosed. The adjustment apparatus includes a main operation device configured to manipulate the processing units and adjust the designated operations, terminal operation devices configured to manipulate the processing units and adjust the designated operations, a network that connects the processing units and the main operation device to each other; and connecting devices configured to connect the terminal operation devices to the network and disconnect the terminal operation devices from the network. Each of the terminal operation devices is configured to be able to manipulate at least one of the processing units.
申请公布号 US2015241866(A1) 申请公布日期 2015.08.27
申请号 US201514596531 申请日期 2015.01.14
申请人 EBARA CORPORATION 发明人 TAKEDA Koichi;NAKAMURA Takamasa
分类号 G05B19/402 主分类号 G05B19/402
代理机构 代理人
主权项 1. An adjustment apparatus for adjusting processing units for performing designated operations on a substrate, comprising: a main operation device configured to manipulate the processing units and adjust the designated operations; terminal operation devices configured to manipulate the processing units and adjust the designated operations, each of the terminal operation devices being configured to be able to manipulate at least one of the processing units; a network that connects the processing units and the main operation device to each other; and connecting devices configured to connect the terminal operation devices to the network and disconnect the terminal operation devices from the network.
地址 Tokyo JP