Clustering for Prediction Models in Process Control and for Optimal Dispatching

摘要

A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route.

主权项

1. A method comprising:
using at least one processor, clustering first tools in a first manufacturing stage into first tool clusters; using at least one processor, clustering second tools in a second manufacturing stage into second tool clusters; and dispatching a wafer processed by one of the first tools to one of the second tools in one of the second tool clusters based on a priority ranking based on the first tool clusters and the second tool clusters.