| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wafer including a laser mark which does not cause a process failure, and a wafer manufactured by the method.SOLUTION: A method for manufacturing a wafer includes: a step S10 of preparing a wafer with a known crystal orientation; a step S20 of forming at least one first mark having a first depth in the wafer; a step S30 of polishing a surface of the wafer; and a step S40 of forming at least one second mark having a second depth shallower than the first depth in the wafer. The step of polishing the surface of the wafer includes a step of removing the surface on which the first mark is formed in a first thickness smaller than the first depth. The second mark is formed so as to separate from the first mark. The wafer includes a front surface, a rear surface, and a side surface. The first mark and the second mark are respectively formed on at least one of the front surface, the rear surface, and the side surface. |
