发明名称 COMPOSITE SHEET, LED PACKAGE USING THE SAME, AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a phosphor composite sheet capable of increasing heat resistance of an optical semiconductor element.SOLUTION: The composite sheet includes: a phosphor layer 3; and an adhesive layer 2 on the phosphor layer. The adhesive layer includes: a matrix resin and metal compound particles. When the metal compound particles are included in the adhesive layer, since thermal conductivity of the metal compound particles is higher than that of the resin, it becomes possible to increase thermal conductivity of the entire adhesive layer.
申请公布号 JP2015149379(A) 申请公布日期 2015.08.20
申请号 JP20140020999 申请日期 2014.02.06
申请人 TORAY IND INC 发明人 SADAKUNI HIRONOBU;SHIGETA KAZUKI;ISHIDA YUTAKA
分类号 H01L33/50;C08K3/00;C08L101/00 主分类号 H01L33/50
代理机构 代理人
主权项
地址