| 摘要 |
<p>The disclosure relates to a method of manufacturing a vertically-conductive sheet. It includes a step of attaching an insulating film having a vertical penetration hole to a substrate functioning as a seed in plating a penetration hole; a step of forming a hole inner plated column in the penetration hole by dipping the insulating film in a plating solution; and a step of separating the insulating film from the substrate by an external force of drawing the insulating film after the insulating film having the hole inner plated column gets out of the plating solution. The step of attaching the substrate, the step of forming the hole inner plated column, and the step of separating the insulating film are successively carried out on different parts of the insulating film.</p> |
