| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently manufacture a semiconductor wafer processing tape by applying an adhesive only to required portions and reducing cutting processes of an adhesive layer as far as possible, as for a method of manufacturing the semiconductor wafer processing tape and the semiconductor processing tape manufactured by the method. <P>SOLUTION: The semiconductor wafer processing tape 10 is manufactured by the manufacturing method including a printing process for forming the adhesive layer 12 by printing a die bonding adhesive on a resin film (support film 11) so as to have a printed area almost equal to or larger than the size of a semiconductor wafer, a drying process for drying the adhesive layer 12, and a sticking process for sticking a dicing tape 15 to the surface opposite to the resin film on the adhesive layer 12 formed on the resin film. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
