Thermal conduction cooling

摘要

An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.

主权项

1. A method for forming an assembly, the method comprising:
placing a discrete surface mount technology (SMT) component adjacent to a first attach pad and to a second attach pad; and mounting the discrete SMT component to the first and second attach pads to form the assembly, wherein the assembly comprises:
a substrate comprising a plurality of conductive plane layers, wherein the plurality of conductive plane layers comprises a first group of common conductive plane layers and a second group of common conductive player layers, and wherein the plurality of conductive plane layers at least partially defines an edge surface of the substrate disposed between a top surface and a bottom surface of the substrate;the first attach pad on the edge surface of the substrate, wherein the first attach pad is thermally coupled to the first group of common conductive plane layers; andthe second attach pad on the edge surface of the substrate, wherein the second attach pad is thermally coupled to the second group of common conductive plane layers, the first attach pad is substantially electrically isolated from the second attach pad, and the first group of common conductive plane layers is substantially electrically isolated from the second group of common conductive plane layers, wherein the discrete SMT component is mounted on the first attach pad and the second attach pad such that the SMT component is thermally coupled to the first group of common conductive plane layers via the first attach pad and to the second group of common conductive plane layers via the second attach pad.