<p>Disclosed are a printed circuit board and a method for manufacturing the same. According to an aspect of the present invention, the printed circuit board includes a base substrate; a first pad formed on the base substrate; a second pad which has a cross-section area larger than that of the first pad and is formed on the upper side of the first pad; a first circuit which is adjacently placed apart from the first pad on the base substrate; and a second circuit which has a cross-section area smaller than that of the first circuit and is formed on the upper side of the first circuit.</p>
