发明名称 Multigate metal oxide semiconductor devices and fabrication methods
摘要 A semiconductor device includes a first well and a second well implanted in a semiconductor substrate. The semiconductor device further includes a gate structure above the first and second wells between a raised source structure and a raised drain structure. The raised source structure above is in contact with the first well and connected with the gate structure through a first semiconductor fin structure. The raised drain structure above and in contact with the second well and connected with a second semiconductor fin structure. The second semiconductor fin structure includes at least a gap and a lightly doped portion.
申请公布号 US9105719(B2) 申请公布日期 2015.08.11
申请号 US201313737682 申请日期 2013.01.09
申请人 Broadcom Corporation 发明人 Ito Akira
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 Brinks Gilson & Lione 代理人 Brinks Gilson & Lione
主权项 1. A semiconductor device, comprising: a first well implanted in a semiconductor substrate; a second well implanted in the semiconductor substrate; a gate structure above the first and second wells; a raised source structure above and in contact with the first well and connected with the gate structure through a first semiconductor fin structure; and a raised drain structure above and in contact with the second well and connected with a second semiconductor fin structure, wherein the second semiconductor fin structure defines a gap along the second semiconductor fin structure that separates the second semiconductor fin structure from the raised drain structure.
地址 Irvine CA US
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