发明名称 |
Multigate metal oxide semiconductor devices and fabrication methods |
摘要 |
A semiconductor device includes a first well and a second well implanted in a semiconductor substrate. The semiconductor device further includes a gate structure above the first and second wells between a raised source structure and a raised drain structure. The raised source structure above is in contact with the first well and connected with the gate structure through a first semiconductor fin structure. The raised drain structure above and in contact with the second well and connected with a second semiconductor fin structure. The second semiconductor fin structure includes at least a gap and a lightly doped portion. |
申请公布号 |
US9105719(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US201313737682 |
申请日期 |
2013.01.09 |
申请人 |
Broadcom Corporation |
发明人 |
Ito Akira |
分类号 |
H01L29/78;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
Brinks Gilson & Lione |
代理人 |
Brinks Gilson & Lione |
主权项 |
1. A semiconductor device, comprising:
a first well implanted in a semiconductor substrate; a second well implanted in the semiconductor substrate; a gate structure above the first and second wells; a raised source structure above and in contact with the first well and connected with the gate structure through a first semiconductor fin structure; and a raised drain structure above and in contact with the second well and connected with a second semiconductor fin structure, wherein the second semiconductor fin structure defines a gap along the second semiconductor fin structure that separates the second semiconductor fin structure from the raised drain structure. |
地址 |
Irvine CA US |