发明名称 |
Method and Apparatus For Maintaining Depth of Focus |
摘要 |
A method includes directing a beam of radiation along an optical axis toward a workpiece support, measuring a spectrum of the beam at a first time to obtain a first profile, measuring the spectrum of the beam at a second time to obtain a second profile, determining a spectral difference between the two profiles, and adjusting a position of the workpiece support along the optical axis based on the difference. A different aspect involves an apparatus having a workpiece support, beam directing structure that directs a beam of radiation along an optical axis toward the workpiece support, spectrum measuring structure that measures a spectrum of the beam at first and second times to obtain respective first and second profiles, processing structure that determines a difference between the two profiles, and support adjusting structure that adjusts a position of the workpiece support along the optical axis based on the difference. |
申请公布号 |
US2015220006(A1) |
申请公布日期 |
2015.08.06 |
申请号 |
US201514682436 |
申请日期 |
2015.04.09 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hsieh Chang-Tsun;Ke Chih-Ming;Liang Fu-Jye;Chen Li-Jui;Fu Tzung-Chi |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
aligning a first exposure field along an optical axis, the first exposure field being supported by a workpiece support; directing a first beam of radiation, with optics of a lithography tool, along the optical axis toward the first exposure field, the optics of the lithography tool having a longitudinal aberration; measuring a spectrum of the first beam to obtain a first spectral profile; aligning a second exposure field along the optical axis, the second exposure field being supported by the workpiece support; directing a second beam of radiation, with optics of the lithography tool, along the optical axis toward the second exposure field; measuring the spectrum of the second beam to obtain a second spectral profile; calculating a spectral offset between the first and second spectral profiles; calculating an adjustment amount based on the spectral offset and the longitudinal aberration; and adjusting a position of the workpiece support along the optical axis by the adjustment amount. |
地址 |
Hsin-Chu TW |