发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 The present invention provides a substrate treatment method using a substrate treatment apparatus comprising a treatment container and a rotary table which is installed in the treatment container to be rotatable and has a substrate loading unit. The substrate treatment method comprises: loading a substrate on the substrate loading unit, and supplying treatment gas into the treatment container to perform a treatment on the loaded substrate. While the substrate is loaded on the substrate loading unit, at least water vapor is supplied into the treatment container, and the substrate on the substrate loading unit is discharged.
申请公布号 KR20150089942(A) 申请公布日期 2015.08.05
申请号 KR20150011062 申请日期 2015.01.23
申请人 TOKYO ELECTRON LIMITED 发明人 HANE HIDEOMI;UMEHARA TAKAHITO
分类号 H01L21/02;H01L21/677 主分类号 H01L21/02
代理机构 代理人
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