| 摘要 |
<p>Provided is a technique which, due to the coating of an insulating film which can effectively suppress partial discharge, both increases the operational reliability of a power module, and enables the power module to be made smaller by reducing the insulation creepage distance. In order to achieve this, the present invention provides a power module which is characterised by being provided with: an insulating substrate; a conductive pattern formed on the insulating substrate; a semiconductor chip connected to the conductive pattern by means of a joining member; an electrode which is formed on the upper surface of the semiconductor chip; and an insulating film which is made from an inorganic material and which coats the outer-peripheral end surface of the semiconductor chip, the joining member which is contiguous with the outer peripheral end surface of the semiconductor chip, the conductive pattern, and the surface of the insulating substrate.</p> |
