| 发明名称 | Expanding device and method for manufacturing components | ||
| 摘要 | In an expanding device that can more effectively expand an adhesive tape in its wafer-attached region and can pick up components on the adhesive tape with high accuracy, a central first portion of an adhesive tape, including a portion with a wafer attached thereto, is laid on a top surface of a heating table, a non-heated ring is disposed to surround an outer peripheral edge of the heating table, a heat insulation is laid on an upper surface of the non-heated ring, a second portion of the adhesive tape located outwardly of the first portion thereof is located on or above the insulation, a third portion of the adhesive tape located outwardly of the second portion is held by a holder, and the holder is movable up and down relative to the heating table and the non-heated ring by a drive unit. | ||
| 申请公布号 | US9101085(B2) | 申请公布日期 | 2015.08.04 |
| 申请号 | US201213707644 | 申请日期 | 2012.12.07 |
| 申请人 | Murata Manufacturing Co., Ltd. | 发明人 | Mizukami Miyuki;Yamada Naohiro |
| 分类号 | H05K13/00;H01L21/67;H01L21/02;H01L21/683 | 主分类号 | H05K13/00 |
| 代理机构 | Keating & Bennett, LLP | 代理人 | Keating & Bennett, LLP |
| 主权项 | 1. An expanding device comprising: a heating table on a top surface of which a central first portion of an adhesive tape, including a portion with a wafer attached thereto, is provided; a non-heated ring arranged to surround an outer peripheral edge of the heating table; a heat insulation which is provided on an upper surface of the non-heated ring and on which a second portion of the adhesive tape located outwardly of the first portion thereof is directly or indirectly provided; a holder arranged to hold a third portion of the adhesive tape located outwardly of the second portion; and a drive unit arranged to move the heating table and the non-heated ring up and down relative to the holder to expand the adhesive tape. | ||
| 地址 | Kyoto JP | ||