STACKED SEMICONDUCTOR SYSTEM HAVING INTERPOSER OF HALF-ETCHED AND MOLDED SHEET METAL

摘要

A semiconductor system (900) has a flat interposer (510) with a first surface (401a) in a first plane, a second surface (401b) in a parallel second plane, and a uniform first height (401) between the surfaces; the interposer is patterned in metallic zones separated by gaps (412, 415), the zones include metal of the first height and metal of a second height (402) smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first (610) and a second (611) set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe (700) is attached to the second terminals of the second set chips, and a second leadframe (800) is attached to respective metallic zones of the second interposer surface.

主权项

1. An interposer for semiconductor devices comprising;
a flat sheet having a first surface in a first plane, a second surface in a parallel second plane, and a uniform first height between the surfaces; the sheet patterned in metallic zones separated by gaps, the zones including metal of the first height and metal of a second height smaller than the first height; and an insulating material filling the gaps and zone differences between the first and the second heights.