发明名称 PASTING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To be capable of sufficiently embedding an adhesive composition into a step part of a substrate to prevent occurrence of a pasting failure.SOLUTION: A pasting method includes: a pressing step of pasting a substrate 1 and a support plate 2 for supporting the substrate 1 through an adhesive layer 3 and pressing by using a plate member 30; and an air pressure adjustment step of placing, after the pressing step, the substrate 1 and the support plate 2 pasted through the adhesive layer 3 under an environment whose air pressure is higher than air pressure of an environment under which the pressing step is performed.</p>
申请公布号 JP2015133465(A) 申请公布日期 2015.07.23
申请号 JP20140052697 申请日期 2014.03.14
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IMAI HIROFUMI;KUBO ATSUSHI;YOSHIOKA TAKAHIRO;NAKADA KIMIHIRO;KATO SHIGERU;IWATA YASUMASA
分类号 H01L21/683;B30B12/00;C09J5/00;C09J201/00;H01L21/02 主分类号 H01L21/683
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