发明名称 CUTTING METHOD
摘要 <p>The present invention is to provide a cutting method capable of dividing a workpiece which is made of a difficult to cut material such as sapphire, etc. without abnormal abrasion of a cutting blade. The cutting method includes a cutting transport process, an x-axis returning transport process, and a z-axis pitching process. In the cutting transport process, the cutting blade (21) which descends as a predetermined amount along a z-axis and is rotated to cut at a predetermined depth (H) for a workpiece (W) while the cutting blade (21) and a chuck table (10) are relatively cut and move as a first transport amount (D1) in an x-axis direction. Therefore, the workpiece (W) is cut as the first transport amount (D1) along a division planning line. In the x-axis returning transport process, the cutting blade (21) and the chuck table (10) are relatively returned in the x-axis direction and a opposite direction with the cutting transport process as a second transport amount (D2) than the first transport amount (D1) while the cutting blade (21) is maintained at the predetermined depth (H) after the cutting transport process is executed. In the z-axis pitching process, the cutting blade (21) which is rotated with an arbitrary timing is moved down and up immediately.</p>
申请公布号 KR20150084645(A) 申请公布日期 2015.07.22
申请号 KR20140187999 申请日期 2014.12.24
申请人 DISCO CORPORATION 发明人 SUZUKI MINORU;KAJIHARA YUSUKE;HIRANUMA CHIHIRO;INOUE TAKAAKI
分类号 H01L21/301;H01L21/76 主分类号 H01L21/301
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