Heat radiating substrate and method for manufacturing the same

摘要

Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

主权项

1. A heat radiating substrate comprising:
a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including mounting pads on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer, wherein the heat radiating substrate includes the control device mounted in an upper portion of the heat radiating substrate, a first radiator which the plurality of holes having the predetermined depth are formed in the lower portion of the heat radiating substrate and a second radiator which is integrally formed at a side of the first radiator and mounts the power device of the upper portion of the heat radiating plate, and wherein the plurality of holes of the first radiator, reduces heat conduction transferred to the first radiator through the second radiator, and protects the control device from the heat generated from the power device.