CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME

摘要

A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at least one region of the first layer of electrically conductive traces. Then a second layer of electrically conductive traces is formed from the second layer of metallic powder and each trace of the second layer is electrically coupled to a trace of the first layer. An insulating material is deposited onto the carrier to provide an insulating substrate that supports the traces. The method does not require the use of any wet chemicals or chemical etching steps.

主权项

1. A method of manufacturing a circuit interconnecting substrate, the method comprising:
depositing a first layer of metallic powder on top of at least one region of a carrier; forming a first layer of electrically conductive traces from the first layer of metallic powder; depositing a second layer of metallic powder onto at least one region of the first layer of electrically conductive traces; forming a second layer of electrically conductive traces from the second layer of metallic powder, each trace of the second layer of electrically conductive traces being electrically coupled to at least one trace of the first layer of electrically conductive traces; and depositing an insulating material onto the carrier, wherein the insulating material forms an insulating substrate that supports the traces.