发明名称 HEAT EXCHANGE SYSTEM, AND SUBSTRATE PROCESSING APPARATUS HAVING SAME
摘要 <p>The purpose of the present invention is to provide a heat exchange system capable of efficiently heating or cooling a processing liquid for processing a substrate. According to the present invention, a substrate processing apparatus (1) comprises a heat exchange system (62) including: heat exchangers (69a, 69b) to heat or cool fluid passing through an inside; a fluid supply unit (81) to supply the fluid to be heated or cooled to the lower part of the heat exchangers (69a, 69b); and a fluid discharge unit (82) to discharge the heated or cooled fluid from the upper part of the heat exchangers (69a, 69b). The fluid supply unit (81) has: inlet pipes (85,86) to allow processing fluid to flow in; a first manifold (87) located upwards more than the upper end of the heat exchangers (69a, 69b), and connected to the inlet pipes (85,86); an exhaust pipe (88) connected with the first manifold (87), and to discharge gas mixed with the processing fluid; and a supply pipe (89) to supply the processing fluid to the heat exchanger from the first manifold (87). The fluid passing through the inside of the heat exchangers (69a, 69b) to the upper side from the lower side is heated or cooled.</p>
申请公布号 KR20150083037(A) 申请公布日期 2015.07.16
申请号 KR20150002082 申请日期 2015.01.07
申请人 TOKYO ELECTRON LIMITED 发明人 KANEKO SATOSHI;MOTOMATSU KAZUKI
分类号 H01L21/324;H01L21/288 主分类号 H01L21/324
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