发明名称 |
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor structure comprises a first conductive material-containing layer. The first conductive material-containing layer comprises a dielectric material, at least two conductive structures in the dielectric material, and an air-gap region in the dielectric material between the at least two conductive structures. The semiconductor structure also comprises a capping layer over the at least two conductive structures and the air-gap region. The semiconductor structure further comprises a second conductive material-containing layer over the capping layer. The second conductive material-containing layer comprises a via plug electrically connected to one of the at least two conductive structures. The via plug is separated from the air-gap region by at least a first predetermined distance. The semiconductor structure additionally comprises a conductive pad over the second conductive material-containing layer. The conductive pad is offset from the air-gap region by at least a second predetermined distance. |
申请公布号 |
US2015200160(A1) |
申请公布日期 |
2015.07.16 |
申请号 |
US201514669331 |
申请日期 |
2015.03.26 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
SU Shu-Hui;HUANG Cheng-Lin;YANG Jiing-Feng;WU Zhen-Cheng;WU Ren-Guei;CHEN Dian-Hau;MII Yuh-Jier |
分类号 |
H01L23/522;H01L21/768;H01L23/532 |
主分类号 |
H01L23/522 |
代理机构 |
|
代理人 |
|
主权项 |
1. A semiconductor structure comprising:
a first conductive material-containing layer, comprising:
a dielectric material;at least two conductive structures in the dielectric material; andan air-gap region in the dielectric material between the at least two conductive structures; a capping layer over the at least two conductive structures and the air-gap region; a second conductive material-containing layer over the capping layer, the second conductive material-containing layer comprising a via plug electrically connected to one of the at least two conductive structures, the via plug being separated from the air-gap region by at least a first predetermined distance; and a conductive pad over the second conductive material-containing layer, the conductive pad being offset from the air-gap region by at least a second predetermined distance. |
地址 |
Hsinchu TW |